YMK NexLiq Liquid Cooling Solution Launches in East China, Dual-City Collaboration Explores New Liquid Cooling Journey

On October 30-31, YMK was invited to showcase at two major industry summits in East China—the "4th Data Center Liquid Cooling Innovation Development and Application Technology Conference (Hangzhou)" and the "6th Liyang Thermal Management Forum." The company systematically presented the technical sophistication, system integration capabilities, and long-term operational stability of its NexLiq full-scenario liquid cooling solution, highlighting its strategic commitment and innovative strength in advancing the large-scale adoption of liquid cooling technology in the era of AI computing power.

The rapid expansion of AI model training and inference has driven GPU cluster power density to unprecedented levels, pushing traditional air cooling to its thermal limits. YMK emphasizes that liquid cooling is not merely a critical solution for high-density computing thermal bottlenecks, but also a core enabler for improving data center energy efficiency and computational performance per watt.

However, the practical deployment of liquid cooling still faces four major challenges—reliability, flexibility, energy efficiency, and coordination: risks of corrosion and leakage, difficulties in adapting inlet liquid temperatures, underutilization of natural cooling sources, and increased complexity in operational coordination with IT systems.

To address these challenges, YMK strategy pivots on "deep integration and system-wide optimization," using its NexLiq solution's systematic design to tackle industry bottlenecks. The solution integrates various technologies such as cold plates, immersion cooling, and hybrid systems, offering the flexibility to support diverse operational needs across the edge-to-core and training-to-inference spectrum.

1) Integration front

YMK innovative "unified air-liquid source" architecture combines two cooling sources into a single system. It allows seamless switching between air and liquid cooling through the flexible coupling of fluorine and water circuits, greatly simplifying operations. The system dynamically balances the cooling modes to maintain a stable temperature field under varying conditions, preventing local overheating and boosting overall reliability.

2) Technological advancement

NexLiq deeply integrates natural cooling technology and adopts distributed cooling sources along with a fully automated fluorine pump system. This enables precise alignment with load variations, minimizes compressor cycling, and achieves continuous optimization of the Cooling Load Factor (CLF) throughout the year. Taking Shanghai as an example, refined control strategies significantly reduce annual cooling energy consumption, fully unleashing the energy-saving potential of natural cooling. Furthermore, the solution supports a broad inlet liquid temperature range of 32–45°C, offering the flexibility to meet the varying cooling requirements of different chip architectures. This forward-looking design aligns with the evolving thermal management demands of future AI chips.

3) System stability assurance

YMK delivers a seamlessly integrated solution encompassing hardware, software, and services. Its software layer combines liquid cooling monitoring with a digital twin platform for thermal simulation, proactive fault alerts, and precise deployment planning. The service component introduces AI-powered inspection and handling robots, enabling automated maintenance in liquid-cooled environments to drive efficiency and enhance asset control.

This initiative goes beyond a showcase, proving YMK core principle of using technology to drive integration and systems to guarantee stability.

Looking ahead, YMK will deepen its liquid cooling R&D and partner with IT and chip leaders to deploy NexLiq. Our goal is to build a greener, more efficient, and reliable foundation for AI compute power, powering the high-quality advancement of the nation's digital transformation.