The China Computing Power Conference 2025 was grandly held in Datong, Shanxi Province from August 22 to 24. As a highly influential, top-tier event in China’s computing power infrastructure sector, the conference centered on the theme "Computing and Network Foundations Paving the Way for an Intelligent Future," bringing together leading enterprises, research institutions, and industry experts to explore technological innovations in computing power and the future of industrial transformation.
At the concurrently held "Computing Center Technology and Ecosystem Forum," Qiao Qiao, Vice President of YMK Technology Group, delivered a keynote speech titled “Liquid-Cooling for 100,000-GPU supercluster, Fan Wall-Managed Heat" The presentation systematically elaborated on the company’s cutting-edge cooling technology solutions addressing the high-density and high-energy consumption challenges of AI computing centers, garnering significant attention.
Liquid Cooling and Fan Wall: A Dual Approach
Tackling the Thermal Barrier in an AI Supercluster
Faced with the robust demand for 100,000-GPU supercluster required for large-scale AI model training, traditional air-cooling systems can no longer adequately meet the dual challenges of heat dissipation and energy efficiency. YMK has introduced the technical philosophy of “Liquid Cooling Powers the Cluster, FanWalls Defeat the Heat,” which achieves end-to-end efficient cooling by applying direct-to-chip liquid cooling to tackle core heat sources and utilizing a systematic Fan Wall solution to manage the entire data center thermal environment.
The company innovatively launched the NexAir Fan Wall Solution, redefining airflow management within data centers through its unique wind wall architecture. The flagship product, the Dynamic Dual Cooling Fan Wall, features a series system design that enables 100% annual utilization of natural cooling sources. With its supply-oriented airflow organization, it achieves over 90% air supply temperature uniformity. Even in high-temperature and high-humidity regions such as South East Asia, it delivers a remarkably low PUE of 1.16–1.2 and WUE of 0.5–1.0 L/kWh, significantly outperforming traditional cooling solutions
In the field of liquid cooling, YMK has launched the NexLiq Full-Stack Liquid Cooling Solution, emphasizing the scientific rationale behind a 30°C coolant temperature. According to research by the Open Compute Project (OCP) and the thermodynamic characteristics of chips, 30°C is regarded as the "sweet spot" that balances chip performance, equipment lifespan, and system compatibility. This approach ensures long-term usability and scalability of the cooling system while addressing the ongoing increase in future chip power density.
From Components to Full Systems
Building a Full-Stack Cooling Ecosystem for AI Computing Centers
In recent years, as AI computing centers have shifted their focus from "rapid construction" to "efficient operation, low energy consumption, and optimized maintenance," YMK has continued to deepen its R&D, driving its transformation from a single-equipment supplier to a system-level solution provider.
Leveraging the JDM (Joint Design Manufacturing) model, YMK collaborates closely with customers to develop customized products such as the WCT integrated refrigerant pump water-free cooling unit. Through optimized air supply and return structures, expanded heat exchange areas, and a hybrid-mode stacked design, a single 300kW unit can save up to 25,439 kWh of electricity annually. For a 100MW data center park, this translates to annual energy savings of 8.48 million kWh, equivalent to reducing carbon emissions by 6,656.8 tons—achieving a dual win of economic benefits and green sustainability.
In the field of multi-connected cooling systems, YMK offers a full range of phase-change multi-system solutions, including both scroll compressor and magnetic levitation compressor technologies. Among these, the magnetic levitation system stands out for its oil-free lubrication and no-return-oil design, delivering superior reliability under long-distance, low-load operating conditions. These systems have been successfully deployed in multiple large-scale AI computing center projects in regions such as Xinjiang and Sichuan, demonstrating their stable performance even in extreme environments.
Looking toward the future
Fan Wall-Liquid Hybrid Cooling, Intelligent Synergy
YMK is proactively developing its "Integrated Hybrid Cooling Source Unit" to drive the deep integration and intelligent coordination of air-cooling and liquid-cooling systems. Through a unified monitoring platform, the company enables global optimized of cooling sources, thermal units, and CDUs (Cooling Distribution Units), enhancing overall system efficiency and response speed.
Looking ahead, YMK will continue to focus on three core principles—Green, Intelligent, and Reliable—deepening R&D in key technologies such as liquid cooling, Fan Wall systems, and intelligent controls. The company is committed to delivering more efficient, flexible, and sustainable data center cooling solutions for the AI era, supporting the customers computing power infrastructure in advancing toward a new stage of high-quality development.
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